Stanford University US-Japan Technology Management Center

SPRING 2003 Seminar/Public Lecture Series
Topics in International Advanced Technology Research

Photonic Interconnects: On-chip and Chip-to-System Photonics

Future optoelectronic devices for communications and interconnections: a perspective

by Masao Fukuma
Vice President of Laboratories, NEC Corporation

This presentation gives an overview of optoelectronic devices for future communications and interconnections. Although today's optical communication business is in crisis, the requirement for future broadband communications is strong. One topic in long communications is the world's broadest ultra-dense WDM transmission with 10.9 Tbps. The key devices used in this system, such as DFB laser diodes, optical amplifier, and detectors, will be shown. For metro/access communications, low-cost and high performance devices such as direct modulation laser diodes and high sensitivity detectors that can be applicable to 10G-Ethernet are essential. This talk will also cover optical interconnections for board-board, chip-chip and intra-chip.


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