Don Gardner has been with Intel Corporation since 1991 and is currently a senior research engineer in the Microprocessor Research Lab and also is a visiting scholar at Stanford University. He has had appointments as a research scientist at Hitachi Research Labs in Japan and as an instructor at Stanford CIS.

Don received his PhD in Electrical Engineering from Stanford University. He is the inventor or co-inventor of 29 patents including for Al-Ti layered metal for interconnections, embedded ground planes, reflow of copper metal, and high-frequency magnetic materials. Don has published and presented over 85 electrical engineering, materials science and computer science papers. He has received 3 Best Paper and Poster awards at international conferences and his recent paper on RF inductors was judged the best at the IEEE IITC conference.

He enjoys bringing new life to old technologies by blending them with different technologies or recent science and materials. His current interests include silicon-based optoelectronic devices, magnetic materials for high-frequency inductors, microstructure design, process technology, and materials science.