Hideyuki Takahara received the B. E. and M. E. degrees in applied chemistry, from Waseda University, Japan, in 1980 and 1982, respectively.

In 1982, he joined the Nippon Telegraph and Telephone Public Corporation (NTT), Tokyo, Japan, where he worked on high capacity ceramic capacitors and optical interconnection modules. From 1989 to 1990, he was a Visiting Scientist at Pennsylvania State University, University Park, where he was engaged in research on the thermal properties of relation-type ferroelectric materials. Currently, he is a Senior Research Engineer in the Network Hardware Integration Laboratory, NTT Microsystem Integration Laboratories.

Mr. Takahara is a vice-chairman of the optical circuit packaging committee of the Japan Institute of Electronics Packaging, a member of the Japan Society of Applied Physics, and the Japan Institute of Electronics, Information, and Communication Engineers.