Stanford University School of Engineering US-Asia Technology Management Center

 

SPRING 2001 Seminar/Public Lecture Series

Topics in International Technology Management


THE IMPACT OF WAFER-LEVEL TECHNOLOGIES ON ADVANCED IC DESIGN



Every Thursday, 4:15 - 5:30 pm
No Admission Charge
Stanford University, Skilling Auditorium

Instructor: Richard Dasher (rdasher at stanford dot edu)

* Available to Stanford students for one-unit credit as EE 402S, Topics in International Technology Management. (Register under EE 402A in Axess.)*


Broadcast live via SITN (Stanford Instructional Television Network)
Stanford Online: Presentations available online to registered students.

 

DATE

SPEAKER

ORGANIZATION

TOPIC

PRESENTATION MATERIALS

4/05

Tom DiStefano, President and CEO, Decision Track

Decision Track
Issues Driving Wafer Level Technologies

Slides (.ppt)

4/12
Sergey Savastiouk, Founder and CEO, Tru-Si Technologies
Tru-Sci Technologies
Moore's Law - the Z Dimension

Slides (.ppt)

4/19

 

David Harame, Senior Manager, SiGe Simulation, Modeling, and Design Kits Dept, IBM

IBM

SiGe BiCMOS Technology: New Possibilities of Integration

Slides (.pdf)

4/26

 

Joseph Fjelstad, Senior Consultant, Pacific Consultants LLC

 

Pacific Consultants LLC

 

Creating a Global Roadmap for Electronics Manufacturing

Slides (.pdf)

5/03

David Sherman, Vice-President, Engineering Alpine Microsystems

Engineering Alpine Microsystems

Silicon-based System in Package

Slides (.pdf)

5/10

Nobuo Takeda, Vice President, R&D Ball Semiconductor Inc.

R&D Ball Semiconductor Inc.

MEMS Applications of Ball Semiconductor Technology

Slides (.pdf)

5/17
Markus Lutz, Robert Bosch Inc.

Robert Bosch Inc.

MEMS Packaging

Slides (.pdf)

5/24

Tadatomo Suga, Professor, Research Center for Advanced Science & Technology (RCAST), University of Tokyo

University of Tokyo

Room temperature bonding: SAB and its applications in microelectronics

Slides (.pdf)

5/31
Stanford Faculty Panel
Stanford University
Stanford's research in wafer technologies

 

 

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