SEMICONDUCTOR PACKAGING AND INTERCONNECTS
INTERNATIONAL TRENDS AND APPLICATIONS
Instructor: Richard Dasher (rdasher at stanford dot edu)
* Available to Stanford students for one-unit credit as EE 402S, Topics in International Technology Management. (Register under EE 402A in Axess.)*
Broadcast live
via SITN (Stanford Instructional Television Network)
Stanford
Online: Presentations available online to registered students.
|
DATE |
SPEAKER |
ORGANIZATION |
TOPIC |
| 4/02 |
Suhas Patil, Chairman Emeritus, Cirrus Logic |
Cirrus Logic
|
Interdependence of Digital System Architechture
and Interconnect Technology
|
| 4/09 |
David Francis, Partner, International Interconnect
Intelligence
|
International Interconnect Intelligence |
Worldwide Overview of Interconnect Technologies
and Research
|
| 4/16 |
David Angst, President, TCAD Inc. |
TCAD Inc. |
Electrical Models, Parameter Extraction, CAD Tools
|
| 4/23 |
Martin Goetz, Director of Packaging Technology, Alpine Microsystems |
Packaging Standards-Related Activities: JEDEC & other focus groups in the US, Europe, and elsewhere |
|
| 4/30 |
Yoshio Nishi, Senior VP & Director of Semiconductor Research and Development, Texas Instruments |
Texas Instruments |
The Present and future of On-Chip Interconnects:
an International Perspective
|
| 5/07 |
|
NEC Corporation |
Overview of NEC Research and Interests in Packaging
|
| 5/14 |
Solomon Beilin, R&D Manager, Fujitsu Computer Packaging Technologies, Inc. |
Fujitsu Computer Packaging Technologies, Inc. |
Overview
of Fujitsu Computer Packaging Activities
|
| 5/21 |
Fuminori Ishitsuka, Sr Res Engr, NTT Optoelectronics Labs |
NTT Optoelectronics Labs |
High-frequency packaging for opto-electronic devices & microwaves/millimeter-wave devices - packages and interconnects |
| 5/28 |
Takao
Fujitsu, Senior Manager, Semiconductor Group, Toshiba Corp.
|
Toshiba
Corp.
|
Institute for Advanced Microsystem Integration (a
new packaging-related research consortium)
|
| 6/04 |
Stanford Faculty Panel Prof. William Dally Prof. David Miller Prof. Krishna Saraswat Prof. Simon Wong |
|
Stanford Perspectives & Activities Architecture for Interconnects Optical Interconnects Update from IEEE's Intnl Inteconnect Tech Conf Reverse Scaling of Interconnects |
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| Page last modified: Wednesday, March 20, 2002 10:50 AM PDT Stanford University US-Asia Technology Management Center Copyright 1995-2002 |