Stanford University School of Engineering US-Asia Technology Management Center

 

SPRING 1998 Seminar/Public Lecture Series

Topics in International Technology Management


SEMICONDUCTOR PACKAGING AND INTERCONNECTS

INTERNATIONAL TRENDS AND APPLICATIONS



Every Thursday, 4:15 - 5:30 pm
No Admission Charge
Stanford University, Skilling Auditorium

Instructor: Richard Dasher (rdasher at stanford dot edu)

* Available to Stanford students for one-unit credit as EE 402S, Topics in International Technology Management. (Register under EE 402A in Axess.)*


Broadcast live via SITN (Stanford Instructional Television Network)
Stanford Online: Presentations available online to registered students.

 

DATE

SPEAKER

ORGANIZATION

TOPIC

4/02

Suhas Patil, Chairman Emeritus, Cirrus Logic

Cirrus Logic
Interdependence of Digital System Architechture and Interconnect Technology
4/09
David Francis, Partner, International Interconnect Intelligence

International Interconnect Intelligence

Worldwide Overview of Interconnect Technologies and Research
4/16

 

David Angst, President, TCAD Inc.

TCAD Inc.

Electrical Models, Parameter Extraction, CAD Tools
4/23

 

Martin Goetz, Director of Packaging Technology, Alpine Microsystems

Alpine Microsystems

 

Packaging Standards-Related Activities: JEDEC & other focus groups in the US, Europe, and elsewhere

4/30

Yoshio Nishi, Senior VP & Director of Semiconductor Research and Development, Texas Instruments

Texas Instruments

The Present and future of On-Chip Interconnects: an International Perspective
5/07

Kazuaki Utsumi, Gen Manager, Material Development Center, NEC Corporation

NEC Corporation

Overview of NEC Research and Interests in Packaging
5/14

 

Solomon Beilin, R&D Manager, Fujitsu Computer Packaging Technologies, Inc.

Fujitsu Computer Packaging Technologies, Inc.

Overview of Fujitsu Computer Packaging Activities
5/21

Fuminori Ishitsuka, Sr Res Engr, NTT Optoelectronics Labs

NTT Optoelectronics Labs

High-frequency packaging for opto-electronic devices & microwaves/millimeter-wave devices - packages and interconnects

5/28
Takao Fujitsu, Senior Manager, Semiconductor Group, Toshiba Corp.
Toshiba Corp.
Institute for Advanced Microsystem Integration (a new packaging-related research consortium)
6/04

Stanford Faculty Panel

Prof. William Dally

Prof. David Miller

Prof. Krishna Saraswat

Prof. Simon Wong

Stanford Perspectives & Activities

Architecture for Interconnects

Optical Interconnects

Update from IEEE's Intnl Inteconnect Tech Conf

Reverse Scaling of Interconnects

 

US-ATMC Event Information

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Page last modified: Wednesday, March 20, 2002 10:50 AM PDT
Stanford University US-Asia Technology Management Center
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