Courses & Events
Innovating Semiconductor and Micro-LED Supply Chains (Zoom-only)
Tuesday, Oct 8, 2024
04:30 pm - 05:50 pm
Our guest speaker, Dr. Kwang-Seong Choi from Korea’s Korea’s Electronics and Telecommunications Research Institute (ETRI), will discuss innovations in supply chains, particularly in the context of semiconductor technology. He plans to address the challenges and solutions for supply chains, highlighting the need for new technologies to improve resilience and efficiency. His talk will include a discussion on the impact of the U.S.-China semiconductor trade war, particularly from a Korean perspective. He will also present advanced semiconductor packaging technologies developed by ETRI, their commercialization strategies, and potential collaborations with Silicon Valley startups.
Our 2024 autumn seminar series on “Topics in International Technology Management | Innovations in Supply Chains and Manufacturing in Asia: Opportunities and Challenges in Realignment” begins September 2024 and continues until December 2024. Seminars will be held most Tuesdays, 4:30 PM – 5:50 PM.
Instructor: Richard Dasher <rdasher [at] stanford [dot] edu>
The series is available to Stanford students for credit; register for EASTASN 402A “Topics in International Technology Management,” also cross-listed as EE-402A and EALC-402A, 1 unit S/NC.
Details
To attend by Zoom, please register at https://stanford.zoom.us/meeting/register/tJcuc-qspz4tH9c4adu7YJ1v6Tfak9ei1Nzl. This will register you for the entire series and the same link will be used for all sessions. After registering, you will receive a confirmation email containing information about joining the meeting series. You may cancel at anytime.
We will not be meeting in-person for this session.
Speakers
Dr. Kwang-Seong Choi
Director & Distinguished Research Fellow, Korea’s Electronics and Telecommunications Research Institute (ETRI)
Kwang–Seong Choi received the B.S. degree from Hanyang University, Seoul, Republic of Korea, and the M.S. and Ph.D. degrees from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.
From 1995 to 2001, he was with Hynix Semiconductor Ltd., Incheon, Republic of Korea, where he was involved in the development of chip scale packages, package-on-packages, and high-speed electronic packages for DDR, Rambus, and RF devices. Since 2001, he has been with Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of Korea, where he is currently working as a director and research fellow. His research interest includes the development of the packaging materials and processes for 3D ICs with through silicon via (TSV), next-generation displays, and large array of thin devices.
Since 2023, he has been serving as one of the directors for the Semiconductor Advanced Packaging Leading Core Technology Development Project under the Ministry of Trade, Industry, and Energy, Korea.
