Courses & Events
From Advanced Bonding Materials to Liquid Cooling Applications: ETRI’s R&D and Startup Commercialization Path (ZOOM-ONLY)
Thursday, Oct 15, 2026
04:30 pm - 05:50 pm
As AI semiconductors become increasingly powerful, advanced materials and thermal management technologies are becoming critical to the future of electronics and data centers. This seminar will explore how the Electronics and Telecommunications Research Institute (ETRI) is moving advanced bonding-material technology from research and development toward real-world industrial applications.
Dr. Kwang-Seong Choi, Assistant Vice President and Director at ETRI, will give a brief overview their patented athermal bonding materials, their development and potential applications in advanced electronics manufacturing. Dr. Yunhyeok Im, CEO of KoolMicro Inc., will then discuss the development of liquid cooling technologies for AI semiconductors using ETRI’s material platform, along with the startup’s strategy for commercialization.
Dr. Richard Dasher, Director of the US-ATMC, will moderate the session and lead a discussion on how collaboration between a research institute and a startup can help translate advanced materials innovation into practical technologies and new commercial opportunities.
Details
Registration:
- To attend online, register on Zoom here.
- This program will be held by Zoom-only.
Speakers
Dr. Kwang-Seong Choi
Assistant Vice President and Director, Electronics and Telecommunications Research Institute (ETRI)
Kwang–Seong Choi received his B.S. degree from Hanyang University, Seoul, Republic of Korea, and the M.S. and Ph.D. degrees from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.
From 1995 to 2001, he was with Hynix Semiconductor Ltd., Incheon, Republic of Korea, where he was involved in the development of chip scale packages, package-on-packages, and high-speed electronic packages for DDR, Rambus, and RF devices. Since 2001, he has been with Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of Korea, where he is currently working as their Assistant Vice President and Director. His research interest includes the development of the packaging materials and processes for 3D ICs with through silicon via (TSV), next-generation displays, and large array of thin devices.
Since 2023, he has been serving as one of the directors for the Semiconductor Advanced Packaging Leading Core Technology Development Project under the Ministry of Trade, Industry, and Energy, Korea.
Dr. Yunhyeok Im
CEO, KoolMicro Inc.
Yunhyeok Im has over 26 years of experience in thermal engineering for semiconductor chips and components, working at Samsung Electronics and Georgia Tech. He has led thermal analysis and design projects for SOC, RF, image sensors, and memory products from early development stages.
Dr. Im holds 54 U.S. patents and has published over 30 papers in the field. His current research focuses on next-generation liquid cooling and advanced thermal architectures for semiconductor packages. He earned his Ph.D. in Mechanical Engineering from KAIST.
